Analysis of Vacuum Potting Technology – From Shenzhen Oric

 I. Technology Overview

Vacuum potting technology, independently developed by Shenzhen Orico Electronics Co., Ltd., is a precision polymer material molding process. It combines vacuum injection molding with high-precision molds and dispensing equipment to achieve low-pressure encapsulation of electronic components. With core advantages of high sealing performance, exceptional stability, and maximized screen-to-body ratio, this technology is widely adopted in consumer electronics (e.g., smartphones, wearables) to meet both functional and aesthetic demands.  

Analysis of Vacuum Potting Technology – From Shenzhen Oric

Key Features:  

1. Superior Sealing: Vacuum environment eliminates bubbles and impurities, ensuring defect-free encapsulation that penetrates microstructures.  

2. Long-Term Stability: Thermosetting/UV-cured materials provide high-temperature resistance and anti-aging properties for reliable performance.  

3. Enhanced Visual Design: Optimized bezel design expands screen display area, elevating end-product aesthetics.  

 

II. Process Flow and Design Constraints

Core Workflow:  

1. Pre-Treatment: Incoming material inspection → Plasma cleaning (Dyne value ≥42A) → FPC bending.  

2. Encapsulation: Dam potting → Vacuum injection → Curing → Demolding.  

3. Post-Treatment: Dimensional measurement → Functional testing (NFC/light sensing) → Visual inspection → Packaging.  


Analysis of Vacuum Potting Technology – From Shenzhen Oric


Design Specifications:  

- Cover Plate: Thickness >1.5 mm; 2.5D curvature must align with client requirements.  

- Structural Compatibility: Injection ports on brackets and frames require reserved space; no-go zones for cables.  

- Material Standards: SCF material thickness ≥0.25 mm; COF bending areas require double-sided reinforcement.  

 

III. Cost and Capacity Planning  

Cost Breakdown:  

- Materials: Thermosetting glue/UV glue (core consumables); silicone molds (limited reuse cycles).  

- Equipment: Steel mold customization (≥40 days lead time); depreciation of injection/plasma/curing systems.  

- Labor & Overhead: Direct labor, QA personnel, R&D/management expenses.  

 

Capacity Roadmap:  

- Current Setup: 7 production lines, 15 injection units, monthly output of 3 million units.  

- Milestones:  

  - Dec. 2024: Add 4 units → Monthly capacity reaches 1.8 million.  

  - Jan. 2025: Expand by 2 units → Monthly capacity hits 2.2 million.  

 

IV. Mass Production Projects and Mold Development

Client Cases:  

- Client M: Delivered 2,150K+ units for 1.74" and 2.07" displays; molds compatible with ≤2.2" screens.  

- New Projects: Custom molds required; size adjustments and validations need 50PCS samples 10 days pre-trial.  

 

V. Project Timeline and Yield Targets

Development Phases:  

1. Mold Cycle: Design review (3 days) → Production (25 days) → Trial validation (10 days).  

2. Pilot Run: EVT to MP stages take 30–50 days, with yield climbing from 50% to 97%.  

 

Critical Notes:  

- Glue and mold preparation require ≥30 days; module anomalies may delay delivery.  

 

VI. Future Technology Directions

1. Process Optimization: Advance UV-curing R&D to reduce thermosetting glue costs and energy use.  

2. Form Factor Expansion: Explore integrated injection for flexible display frames and stepped potting designs.  

3. Structural Innovation: Redesign injection ports to free internal space for complex device integration.  

 

Conclusion  

Shenzhen Oric continues to empower the consumer electronics industry through its vacuum potting technology. By scaling capacity, optimizing costs, and advancing R&D, the company delivers cost-effective solutions that drive smarter, slimmer, and more reliable devices.  


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